High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method

High Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
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170
By:"Sofie Burger"

Published on 2013 by KIT Scientific Publishing

It has to be noted that the thin film data on Si substrate in the HCF regime is \u003cbr\u003e\ncompared to \u003cb\u003eLCF\u003c/b\u003e experiments, thin films on polymer substrate, freestanding thin \u003cbr\u003e\nfilms, and micro samples with a comparable grain size. Also, the test frequencies \u003cbr\u003e\nand ...

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